ITM-330 Industrial Thermal Solution for COM Express Basic Modules

ITM-330

Industrial Thermal Solution for
COM Express Basic Modules

100% CPU Power No Throttling

45W CPU @ 60C

Thin & Light

Height: 27 mm /
Weight: 250 g

Silent Operating

45 dB @4300 rpm
(Full Run)

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We see your challenges for optimized thermal design

Advantech understands your various challenges while developing high computing performance applications in medical, factory automation, and edge computing. Quadro Flow Colling System (QFCS) is designed for optimized thermal design. It ticks several boxes such as high heat dissipation efficiency, low noise margins, and a compact heatsink.

CPU Temperature Overheat

PCB Bending & CPU Crash

Solution for Space-limited System

High Noise Level

Complex Assembly Process & Extra Jig Cost

Release 100% power of TDP 45W processor @ 60°C

Silent Operating

Low Noise Design Reduces User Annoyance

Easy Assembly

Tool-free design to simplify assembly process

Thin & Light Cooling Solution

Thermal Technology Innovation

A

Two-phase heat exchange pipe

Dual copper heat pipes quickly equalize temperature

B

Mixed fin structure

Stacked & extrusion fins designed to maximize cooling surface and air exchange

C

CPU hard contact

Copper block dissipates heat quickly by making direct contact with CPU

D

Venting holes

Vertical airflow for expediting memory heat dissipation

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